Aluminum Copper Lead

Yunnan Germanium secures large indium phosphide wafer supply deal

On July 23, Yunnan Germanium Co., Ltd. announced that its holding subsidiary, Yunnan Xinyao Semiconductor Materials Co., Ltd., has entered into a wafer supply agreement with a customer. The contract covers the sale of indium phosphide wafers (substrates) and is estimated to total between RMB570 million (USD84.12 million) and RMB855 million (USD126.18 million) on a tax inclusive basis, equivalent to 53.48% to 80.23% of the company's audited operating revenue for fiscal year 2025. Deliveries under the agreement are scheduled to take place in batches from August 1, 2026 through December 31, 2027.