HT-tech to invest RMB2.86 billion in advanced encapsulation and test research and industrialization project
On March 27, HT-tech announced that its fully owned subsidiary HT Jiangsu plans to invest RMB2,858 million (USD415 million) into constructing a high-density high-reliability encapsulation and test research and industrialization project, which is expected to have an annual wafer integrated circuit encapsulation and test capacity of 840,000 pieces of Bumping, 480,000 pieces of WLCSP, and 26,000 pieces of super-high-density UHDFO.
