On September 17, Infineon announced that its 300mm thin wafer power semiconductor chip factory in Villach, Austria was officially put into operation. Prior to this, the new plant was put into operation in early August, three months ahead of the original plan.

It is understood that with a total investment of 1.6 billion euros, this factory is one of the largest projects of its kind in the field of microelectronics in Europe and one of the most modern semiconductor device factories. The first batch of wafers from the new factory will be shipped this week. The chip is manufactured on a 300 mm wafer, which is only 40 microns thick.