On March 25, Anxi, Quanzhou, Fujian, held the signing and starting and completion activity of key projects for the first quarter of 2021.

At this event, Tongmei Technology Innovation Industrial Park project was signed. With a planned total investment of RMB10 billion (USD1.52 billion), the project will focus on introducing semiconductor basic materials research laboratories to build a science and technology innovation park with integrated circuit industry cluster, internet of things and information industry cluster as well as intelligent manufacturing automation and smart home integration industry cluster which integrates the entire industry chain including semiconductor consumables, packaging and testing, system modules and others.