Aluminum Copper Lead

Refond to raise about RMB700 million

On October 15, Refond issued a notice saying that the Shenzhen Stock Exchange had reviewed the company's proposal and found that the company met the requirements for issuance, listing and information disclosure, and that the Shenzhen Stock Exchange would report the company to the China Securities Regulatory Commission in accordance with the relevant registration procedures.

According to the placement plan, the total amount of funds the company intends to raise in this issue will not exceed RMB699 million (USD104.01 million), including RMB370 million (USD55.06 million) for Mini LED backlight packaging and production project, RMB275 million (USD40.92 million) for full-color LED packaging and production expansion project, and RMB54.84 million (USD8.16 million) for Micro LED technology R&D center project.